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Multilayer Rigid HDI PCB Printed Circuit Board Tablet Computer Electronics Manufacturing

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Shenzhen Tecircuit Electronics Limited
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City:shenzhen
Country/Region:china
Contact Person:MrDavid Zeng
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China Multilayer Rigid HDI PCB Printed Circuit Board Tablet Computer Electronics Manufacturing wholesale
  • China Multilayer Rigid HDI PCB Printed Circuit Board Tablet Computer Electronics Manufacturing wholesale

Multilayer Rigid HDI PCB Printed Circuit Board Tablet Computer Electronics Manufacturing
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Brand Name :TECircuit
Model Number :TEC0153
Certification :UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH. W
Place of Origin :China
MOQ :1pcs
Price :USD 1.99 ~ USD9.99/pcs
Payment Terms :L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability :50000 pcs/month
Delivery Time :5-15 wotk days
Packaging Details :Vacuum package+Carton box
Brand :Shenzhen Tecircuit Electronics Co., Ltd
Product Type :PCB,High frequency board,RIGID PCB,Rigid board,Flexible board,Rigid-Flex PCB,IC-Substrate,Metal Core
Item No. :R0056
Service :PCBA service
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Multilayer Rigid HDI PCB Printed Circuit Board Tablet Computer Electronics Manufacturing

About TECircuit

Found: TECircuit has been operating since 2004.

Location: An electronics manufacturing service(EMS) provider located in Shenzhen China.

Item: Customizable EMS PCB, offers a full range of one-stop shop services.

Service: Printed Circuit Board (PCB)and Printed Circuit Board Assembly(PCBA), Flexible Printed Circuit Board(FPC), Components Sourcing, Box-Building, Testing.

Quality Assurance: UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949 andcomplied with ROHS and REACH.

Factory Pictures:
Company's own plant : 50,000 sqm; Employees : 930+; Monthly production capacity : 100,000 m2

Product Applications

  • Main Logic Board:

    • Used in the central processing unit (CPU) and graphics processing unit (GPU) circuits, providing high-density connections for powerful performance.

  • Display Interface:

    • Employed in connections for touchscreens and LCD/LED displays, ensuring high-resolution output and responsiveness.

  • Power Management Systems:

    • Integrated into circuits that manage battery charging, power distribution, and energy efficiency to prolong battery life.

  • Wireless Communication Modules:

    • Used in Wi-Fi, Bluetooth, and cellular connectivity components, ensuring reliable and fast data transmission.

  • Camera Modules:

    • Employed in circuits that support front and rear cameras, enabling high-quality image and video processing.

  • Audio Systems:

    • Integrated into audio amplifier circuits and speaker connections, providing high-quality sound output.

  • Sensors:

    • Used in various sensors, such as accelerometers and gyroscopes, enhancing functionalities like orientation detection and motion sensing.

  • Storage Interfaces:

    • Employed in connections for flash memory storage, ensuring fast data access and transfer rates.

  • Charging Ports:

    • Integrated into USB-C or other charging interfaces, facilitating efficient power transfer and data connectivity.

  • Thermal Management Systems:

    • Used in designs that require effective heat dissipation, maintaining optimal performance during prolonged use.

Product Features

  1. High Density:

    • HDI (High-Density Interconnect) PCBs allow for compact designs with a high number of components, essential for slim tablet profiles.

  2. Improved Signal Integrity:

    • Shorter traces and optimized routing enhance signal quality, crucial for high-speed data transfer and communication.

  3. Better Thermal Management:

    • Advanced materials and multilayer designs help dissipate heat effectively, preventing overheating during intensive tasks.

  4. Enhanced Routing Flexibility:

    • The use of microvias and buried vias allows for complex circuit layouts, maximizing space efficiency.

  5. Lightweight Design:

    • Reduced material usage contributes to lighter tablet designs, improving portability and user experience.

  6. Cost Efficiency in Mass Production:

    • While initial costs may be higher, HDI PCBs can be cost-effective for large-scale manufacturing due to their performance advantages.

  7. Customizability:

    • Can be tailored to meet specific design requirements, enabling unique layouts and configurations for various tablet models.

  8. Durability:

    • Built to withstand environmental factors, ensuring reliable performance in everyday use.

  9. Regulatory Compliance:

    • Designed to meet industry standards for safety and performance, ensuring dependable operation in consumer electronics.

  10. Ease of Integration:

    • Compatible with a wide range of components, facilitating the incorporation of advanced features and technologies in tablets.

FAQ

Question 1: What is needed for a quotation?
Answer:
PCB: QTY, Gerber file, and Technical Requirements( material/surface finish treatment/copper thickness/board thickness,...)
PCBA: PCB information, BOM,(Testing documents...)

Q2: What file formats do you accept for production?
Answer:
PCB Gerber file
BOM list for PCB
Test method for PCBA

Q3: Are my files safe?
Answer:
Your files are held completely safe and secure. We protect the IP for our customers in the whole process. All documents from customers are never shared with any 3rd parties.

Q4: What is the shipment method?
Answer:
We can offer FedEx /DHL / TNT / UPS for shipment. Also, customer provided shipment method is acceptable.

Q5: What is the payment method?
Answer:
Telegraphic Transfer in advance (Advance TT, T/T), PayPal is acceptable.

​Product Description​

Specification:
PCB layers: 1-42layers
PCB materials: CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
PCB max. board size: 620mm*1100mm
PCB certificate: RoHS Directive-Compliant
PCB Thickness: 1.6 ±0.1mm
Out Layer Copper Thickness: 0.5-5oz
Inner Layer Copper Thickness: 0.5-4oz
PCB max. board thickness: 6.0mm
Minimum Hole Size: 0.20mm
Minimum Line Width/Space: 3/3mil
Min. S/M Pitch: 0.1mm(4mil)
Plate Thickness and Aperture Ratio : 30:1
Minimum Hole Copper: 20µm
Hole Dia. Tolerance(PTH): ±0.075mm(3mil)
Hole dia. Tolerance(NPTH): ±0.05mm (2mil)
Hole Position Deviation: ±0.05mm (2mil)
Outline Tolerance: ±0.05mm (2mil)
PCB solder mask: Black, white, yellow
PCB surface finished: HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver
Legend: White
E-test: 100% AOI, X-ray, Flying probe test.
Outline: Rout and Score/V-cut
Inspection Standard: IPC-A-610CCLASSII
Certificates: UL (E503048),ISO9001/ISO14001/IATF16949
Outgoing Reports: Final Inspection, E-test, Solderability Test, Micro Section and More
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